Top Suppliers Vlp Copper Foil - Shielded ED copper foils – CIVEN
Top Suppliers Vlp Copper Foil - Shielded ED copper foils – CIVEN Detail:
Product Introduction
The electrolytic copper foil for shielding produced by CIVEN METAL can effectively shield electromagnetic signals and microwave interference because of the high purity of copper. The electrolytic production process makes the width of material wider than 1.2 meters(48 inches), which allows for flexible applications in a wide range of fields. The copper foil itself has a very flat shape and can be perfectly molded to other materials. The copper foil is also resistant to high temperature oxidation and corrosion, allowing it to be used in harsh environments or in products where material life is critical.
Specifications
CIVEN can provide 1/4oz-3oz (nominal thickness 9μm -105μm) shielding electrolytic copper foil with a maximum width of 1290mm, or various specifications of shielding electrolytic copper foil with a thickness of 9μm -105μm according to customer requirements with product quality meeting the requirements of IPC-4562 standard II and III.
Performance
It has good moisture resistance, chemical resistance, thermal conductivity and UV resistance, and is suitable for preventing interference with static electricity and electromagnetic waves.
Applications
Mainly used: transformers, cables, cell phones, computers, medical, aerospace, military and other electronic products shielding.
Performance(GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
50μm |
70μm |
105μm |
|
|
Cu Content |
% |
≥99.8 |
|||||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
440±8 |
585±10 |
875±15 |
|
|
Tensile Strength |
R.T.(23℃) |
Kg/mm2 |
≥28 |
||||||
|
H.T.(180℃) |
≥15 |
≥18 |
≥20 |
||||||
|
Elongation |
R.T.(23℃) |
% |
≥5.0 |
≥6.0 |
≥10 |
||||
|
H.T.(180℃) |
≥6.0 |
≥8.0 |
|||||||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
||||||
|
Matte(Rz) |
≤3.5 |
||||||||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.9 |
≥1.0 |
≥1.0 |
≥1.5 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤7.0 |
|||||||
|
Change of color(E-1.0hr/200℃) |
% |
Good |
|||||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
|||||||
|
Appearance(Spot and copper powder) |
—- |
None |
|||||||
|
Pinhole |
EA |
Zero |
|||||||
|
Size Tolerance |
Width |
0~2mm |
0~2mm |
||||||
|
Length |
—- |
—- |
|||||||
|
Core |
Mm/inch |
Inside Diameter 76mm/3 inch |
|||||||
Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
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