Top Suppliers Vlp Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN
Top Suppliers Vlp Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:
Product Introduction
The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.
Specifications
Thickness: 1/4OZ~20OZ(9µm~70µm)
Width: 550mm ~1295mm
Performance
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
Applications
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.
Advantages
The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.
Performance(GB/T5230-2000、IPC-4562-2000)
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
Cu Content |
% |
≥99.8 |
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Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
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H.T.(180℃) |
≥15 |
|||||||
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
||
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
|||||
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
|||||
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
||
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
||||||
Change of color(E-1.0hr/190℃) |
% |
Good |
||||||
Solder Floating 290℃ |
Sec. |
≥20 |
||||||
Pinhole |
EA |
Zero |
||||||
Preperg |
—- |
FR-4 |
Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:

Related Product Guide:
Our company sticks to the principle of "Quality is the life of the company, and reputation is the soul of it" for Top Suppliers Vlp Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Kuwait, Portland, Mumbai, With the development and enlargement of mass clients abroad, now we have set up cooperative relationships with many major brands. We have our own factory and also have many reliable and well-cooperated factories in the field. Adhering to the "quality first, customer first, We are provideing high-quality, low-cost products and first-class service to customers. We sincerely hope to establish business relationship with customers from all over the world on the basis of quality, mutually benefit. We welcome OEM projects and designs.

The quality of the products is very good, especially in the details, can be seen that the company work actively to satisfy customer's interest, a nice supplier.
