Top Suppliers Vlp Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN
Top Suppliers Vlp Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:
Product Introduction
The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.
Specifications
Thickness: 1/4OZ~20OZ(9µm~70µm)
Width: 550mm ~1295mm
Performance
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
Applications
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.
Advantages
The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.
Performance(GB/T5230-2000、IPC-4562-2000)
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
Cu Content |
% |
≥99.8 |
||||||
Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
||||
H.T.(180℃) |
≥15 |
|||||||
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
||
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
|||||
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
|||||
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
||
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
||||||
Change of color(E-1.0hr/190℃) |
% |
Good |
||||||
Solder Floating 290℃ |
Sec. |
≥20 |
||||||
Pinhole |
EA |
Zero |
||||||
Preperg |
—- |
FR-4 |
Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
We support our purchasers with ideal high-quality merchandise and significant level company. Becoming the specialist manufacturer in this sector, we now have received loaded practical encounter in producing and managing for Top Suppliers Vlp Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Anguilla, Riyadh, Israel, So that you can utilize the resource from the expanding info in international trade, we welcome shoppers from everywhere on-line and offline. In spite of the good quality solutions we offer, effective and satisfying consultation service is supplied by our specialist after-sale service team. Product lists and detailed parameters and any other info weil be sent to you timely for your inquiries. So please make contact with us by sending us emails or call us if you have any questions about our corporation. ou may also get our address info from our web page and come to our company to get a field survey of our merchandise. We are confident that we are going to share mutual achievement and create strong co-operation relations with our companions in this marketplace. We're searching forward for your inquiries.
By Genevieve from Belgium - 2018.05.15 10:52
Good quality and fast delivery, it's very nice. Some products have a little bit problem, but the supplier replaced timely, overall, we are satisfied.
By Agustin from Paraguay - 2017.09.26 12:12