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Top Quality Silver Plated Copper Foil - ED Copper Foils for FPC – CIVEN

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While using the "Client-Oriented" company philosophy, a demanding high-quality management method, innovative producing products and also a sturdy R&D workforce, we always deliver premium quality merchandise, superb solutions and aggressive selling prices for Reverse Treat Foil, Transformer Copper Foil, Flexible Printed Circuits Copper Foil, Together with our efforts, our products and solutions have won the trust of clients and been very salable each here and abroad.
Top Quality Silver Plated Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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Top Quality Silver Plated Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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The corporation keeps to the operation concept "scientific management, superior quality and performance primacy, consumer supreme for Top Quality Silver Plated Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Las Vegas, Kuwait, Paris, By adhering to the principle of "human oriented, winning by quality", our company sincerely welcomes merchants from at home and abroad to visit us, talk business with us and jointly create a brilliant future.
  • This company has a lot of ready-made options to choose and also could custom new program according to our demand, which is very nice to meet our needs.
    5 Stars By Kevin Ellyson from Congo - 2018.12.14 15:26
    The customer service staff is very patient and has a positive and progressive attitude to our interest, so that we can have a comprehensive understanding of the product and finally we reached an agreement, thanks!
    5 Stars By Moira from Algeria - 2018.11.04 10:32
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