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Special Design for Flexible Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Innovation, excellent and reliability are the core values of our business. These principles today extra than ever form the basis of our success as an internationally active mid-size company for Copper Sheet, Battery Copper Foil, Circuit Board Copper Foil, Welcome your enquiry, greatest service is going to be provided with full heart.
Special Design for Flexible Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


Product detail pictures:

Special Design for Flexible Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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No matter new shopper or old customer, We believe in very long expression and dependable relationship for Special Design for Flexible Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Peru, Singapore, Danish, They are sturdy modeling and promoting effectively all over the world. Never ever disappearing major functions within a quick time, it's a have to for you of fantastic good quality. Guided by the principle of Prudence, Efficiency, Union and Innovation. the corporation. ake an excellent efforts to expand its international trade, raise its organization. rofit and raise its export scale. We are confident that we are going to have a bright prospect and to be distributed all over the world in the years to come.
  • Products and services are very good, our leader is very satisfied with this procurement, it is better than we expected,
    5 Stars By Irma from kazakhstan - 2017.05.02 11:33
    Hope that the company could stick to the enterprise spirit of "Quality, Efficiency, Innovation and Integrity", it will be better and better in the future.
    5 Stars By Federico Michael Di Marco from Nigeria - 2017.08.21 14:13
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