Special Design for Flexible Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN
Special Design for Flexible Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN Detail:
Product Introduction
Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.
Dimension Range
Thickness: 9µm～35µm
Performances
The product surface is black or red, has lower surface roughness.
Applications
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features
High density, high bending resistance and good etching performance.
Microstructure
SEM(Before Surface Treatment)
SEM(Shiny Side after Treatment)
SEM(Rough Side after Treatment)
Table1- Performance (GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
|
Cu Content |
% |
≥99.8 |
||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
|
Tensile Strength |
R.T.(23℃) |
Kg/mm2 |
≥28 |
|||
|
H.T.(180℃) |
≥15 |
≥15 |
≥15 |
≥18 |
||
|
Elongation |
R.T.(23℃) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
|
H.T.(180℃) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
|
Matte(Rz) |
≤2.5 |
|||||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤7.0 |
||||
|
Change of color(E-1.0hr/200℃) |
% |
Good |
||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
||||
|
Appearance(Spot and copper powder) |
—- |
None |
||||
|
Pinhole |
EA |
Zero |
||||
|
Size Tolerance |
Width |
mm |
0~2mm |
|||
|
Length |
mm |
—- |
||||
|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
||||
Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.
2. The performance index is subject to our testing method.
3. The quality guarantee period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
Our firm promises all consumers with the first-class products as well as most satisfying post-sale services. We warmly welcome our regular and new consumers to join us for Special Design for Flexible Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Estonia, Barcelona, Belgium, In order to make more people know our products and to enlarge our market, we have devoted a lot of attention to technical innovations and improvement, as well as replacement of equipment. Last but not the least, we also pay more attention to training our managerial personnel, technicians and workers in planned way.
By Ella from Hongkong - 2018.06.18 19:26
The goods are very perfect and the company sales manager is warmful, we will come to this company to purchase next time.
By Rose from Uruguay - 2018.11.28 16:25
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