Special Design for Flexible Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN
Special Design for Flexible Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN Detail:
Product Introduction
Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.
Dimension Range
Thickness: 9µm～35µm
Performances
The product surface is black or red, has lower surface roughness.
Applications
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features
High density, high bending resistance and good etching performance.
Microstructure
SEM(Before Surface Treatment)
SEM(Shiny Side after Treatment)
SEM(Rough Side after Treatment)
Table1- Performance (GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
|
Cu Content |
% |
≥99.8 |
||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
|
Tensile Strength |
R.T.(23℃) |
Kg/mm2 |
≥28 |
|||
|
H.T.(180℃) |
≥15 |
≥15 |
≥15 |
≥18 |
||
|
Elongation |
R.T.(23℃) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
|
H.T.(180℃) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
|
Matte(Rz) |
≤2.5 |
|||||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤7.0 |
||||
|
Change of color(E-1.0hr/200℃) |
% |
Good |
||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
||||
|
Appearance(Spot and copper powder) |
—- |
None |
||||
|
Pinhole |
EA |
Zero |
||||
|
Size Tolerance |
Width |
mm |
0~2mm |
|||
|
Length |
mm |
—- |
||||
|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
||||
Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.
2. The performance index is subject to our testing method.
3. The quality guarantee period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
With advanced technologies and facilities, strict good quality manage, reasonable rate, superior assistance and close co-operation with shoppers, we have been devoted to supplying the very best price for our consumers for Special Design for Flexible Circuit Board Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Estonia, Seychelles, New York, Our company considers that selling is not only to gain profit but also popularize the culture of our company to the world. So we are working hard to give you the wholehearted service and willing to give you the most competitive price in the market
By Norma from Jamaica - 2017.04.18 16:45
Good quality and fast delivery, it's very nice. Some products have a little bit problem, but the supplier replaced timely, overall, we are satisfied.
By Andrew Forrest from Florence - 2018.12.10 19:03
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