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Renewable Design for Negative Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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We emphasize advancement and introduce new products into the market each year for Single Shiny Copper Foil, Cooling Copper Foil, Tinned Copper Sheet, We are looking forward to establishing cooperative relationships with you. Please contact us for more information.
Renewable Design for Negative Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


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Renewable Design for Negative Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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Our company has been concentrating on brand strategy. Customers' pleasure is our greatest advertising. We also source OEM service for Renewable Design for Negative Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Guatemala, Lithuania, Indonesia, Upon today, we have customers from all over the world, including USA, Russia, Spain, Italy, Singapore, Malaysia, Thailand, Poland, Iran and Iraq. The mission of our company is to provide the highest quality products with best price. We are looking forward to doing business with you.
  • We feel easy to cooperate with this company, the supplier is very responsible, thanks.There will be more in-depth cooperation.
    5 Stars By Dawn from Paraguay - 2017.12.19 11:10
    The company can keep up with the changes in this industry market, product updates fast and the price is cheap, this is our second cooperation, it's good.
    5 Stars By Faithe from Greece - 2017.03.28 16:34
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