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Popular Design for Thermo Exchange Copper Foil - ED Copper Foils for FPC – CIVEN

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Our mission is usually to turn into an innovative provider of high-tech digital and communication devices by furnishing benefit added design and style, world-class manufacturing, and service capabilities for Tinned Copper Foil, Beryllium Copper Foil, Black Back Copper Foil, Our company warmly welcome friends from all over the world to visit, investigate and negotiate business.
Popular Design for Thermo Exchange Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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Popular Design for Thermo Exchange Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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We support our buyers with ideal high quality products and high level service. Becoming the specialist manufacturer in this sector, we have gained rich practical experience in producing and managing for Popular Design for Thermo Exchange Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Ethiopia, St. Petersburg, Nicaragua, We have been sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy you with our high-quality products and solutions and perfect service . We also warmly welcome customers to visit our company and purchase our products.
  • We feel easy to cooperate with this company, the supplier is very responsible, thanks.There will be more in-depth cooperation.
    5 Stars By Adela from The Swiss - 2017.08.15 12:36
    We feel easy to cooperate with this company, the supplier is very responsible, thanks.There will be more in-depth cooperation.
    5 Stars By Jack from America - 2018.09.29 17:23
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