Online Exporter High-End Circuit Board Copper Foil - RA Copper Foil – CIVEN
Online Exporter High-End Circuit Board Copper Foil - RA Copper Foil – CIVEN Detail:
Rolled Copper Foil
The metal material with the highest copper content is called pure copper. It is also commonly known as red copper because of its surface appears reddish-purple colour. Copper has a high degree of flexibility and ductility. It also has excellent electrical and thermal conductivity. The copper foil produced by CIVEN METAL not only has high purity and low impurity characteristics, but also has a smooth surface finish, flat sheet shape and very good uniformity. They are suitable for use as electrical, thermal and electromagnetic shielding materials. The rolled copper foil from CIVEN METAL is also highly machinable and easy to shape and laminate. Due to the spherical structure of the rolled copper foil, the soft and hard state can be controlled by the annealing process, making it more suitable for a wide range of applications. CIVEN METAL can also produce copper foils in different thicknesses and widths according to customer requirements, thus reducing production costs and improving processing efficiency.
Base Material | C11000 Copper, Cu > 99.90% |
Thickness Range | 0.01mm-0.15mm (0.0004inch~0.006inch) |
Width Range | 4mm-400mm(0.16inch~16inch) |
Temper | Hard, Half Hard, Soft |
Application | Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction, Decoration etc. |
GB |
ALLOY NO. |
SIZE (mm) |
||||
(ISO) |
(ASMT) |
(JIS) |
(BIS) |
(DIN) |
||
T2 |
Cu-ETP |
C11000 |
C1100 |
C101 |
R-Cu57 |
Thickness: 0.01-0.15/Max Width: 400 |
TU2 |
Cu-OF |
C10200 |
C1020 |
Cu-OFC |
OF-Cu |
Mechanical Properties
Temper |
JIS Temper |
Tensile Strength Rm/N/mm 2 |
Elongation A50/% |
Hardness HV |
M |
O |
220~275 |
≥ 15 |
40~60 |
Y2 |
1/4H |
240~300 |
≥ 9 |
55~85 |
Y |
H |
330~450 |
- |
80~150 |
Note: We can provide products with other properties according to customers` requirements.
Physical Properties
Density | 8.9g/cm3 |
Electrical conductivity (20°C) | min 90%IACS for annealed to temper min 80%IACS for rolled to temper |
Thermal conductivity (20°C) | 390W/(m°C) |
Elastic modulus | 118000N/m |
Softening temperature | ≥380°C |
Sizes and Tolerances (mm)
Thickness |
Thickness Tolerances |
Width |
Width Tolerances |
0.01~0.015 |
± 0.002 |
4~250 |
± 0.1 |
> 0.018~0.10 |
± 0.003 |
4~400 |
|
> 0.10~0.15 |
± 0.005 |
4~400 |
Specifications Available (mm)
Thickness |
Width |
Temper |
0.01~0.015 |
4~250 |
O,H |
> 0.018~0.10 |
4~400 |
O,H |
> 0.10~0.15 |
4~400 |
O,1/2H,H |
Carried Standard(Latest)
Nations |
Standard No. |
Standard Name |
China |
GB/T2059–2000 | CHINA’S NATIONAL STANDARD |
Japan |
JIS H3100 :2000 | COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS |
U.S.A |
ASTM B36/B 36M -01 | STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR |
Germany |
DIN-EN 1652:1997 | COPPER AND COPPER ALLOYS PLATE,SHEET,STRIP AND CIRCLES FOR GENERAL PURPOSES |
DIN-EN 1758 :1997 | COPPER AND COPPER ALLOYS STRIP FOR LEADFRAMES | |
SEMI |
SEMI G4-0302 | SPECIFICATION FOR INTERGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
Product detail pictures:
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By Dee Lopez from Canada - 2018.09.29 17:23