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OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN

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Innovation, good quality and reliability are the core values of our enterprise. These principles today extra than ever form the basis of our success as an internationally active mid-size organization for Heating Copper Foil, Bare Copper Tape, Ed Nickel Foil, our merchandise have superior popularity from the whole world as its most competive cost and our most advantage of after-sale assistance for the clients。
OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN detail pictures


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Our well-equipped facilities and superb good quality control throughout all stages of manufacturing enables us to guarantee total buyer gratification for OEM/ODM Supplier Copper Beryllium Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Congo, Irish, Liberia, With the spirit of "credit first, development through innovation, sincere cooperation and joint growth", our company is striving to create a brilliant future with you, so as to become a most valuable platform for exporting our goods in China!
  • The manufacturer gave us a big discount under the premise of ensuring the quality of products, thank you very much, we will select this company again.
    5 Stars By Amy from Bolivia - 2017.09.28 18:29
    This supplier stick to the principle of "Quality first, Honesty as base", it is absolutely to be trust.
    5 Stars By Juliet from Florida - 2018.06.05 13:10
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