OEM/ODM Factory Circuit Foil - VLP ED Copper Foils – CIVEN

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OEM/ODM Factory Circuit Foil - VLP ED Copper Foils – CIVEN Detail:

Product Introduction

The very low profile electrolytic copper foil produced by CIVEN METAL has the characteristics of low roughness and high peel strength. The copper foil produced by the electrolysis process has the advantages of high purity, low impurities, smooth surface, flat board shape, and large width. The electrolytic copper foil can be better laminated with other materials after roughening on one side, and it is not easy to peel off.

Specifications

CIVEN can provide ultra-low profile high temperature ductile electrolytic copper foil (VLP) from 1/4oz to 3oz (nominal thickness 9µm to 105µm), and the maximum product size is 1295mm x 1295mm sheet copper foil.

Performance

CIVEN provides ultra-thick electrolytic copper foil with excellent physical properties of equiaxial fine crystal, low profile, high strength and high elongation. (See Table 1)

Applications

Applicable to the manufacture of high-power circuit boards and high-frequency boards for automotive, electric power, communication, military and aerospace.

Characteristics

Comparison with similar foreign products.

● The grain structure of our VLP electrolytic copper foil is equiaxed fine crystal spherical; while the grain structure of similar foreign products is columnar and long.

● Electrolytic copper foil is ultra-low profile, 3oz copper foil gross surface Rz ≤5µm; while similar foreign products are standard profile, 3oz copper foil gross surface Rz > 3.5µm.

Advantages

● Since our product is ultra-low profile, it solves the potential risk of the line short circuit due to the large roughness of the standard thick copper foil and the easy penetration of the thin insulation sheet by the “wolf tooth” when pressing the double-sided panel.

● Because the grain structure of our products is equiaxed fine crystal spherical, it shortens the time of line etching and improves the problem of uneven line side etching.

● while having high peel strength, no copper powder transfer, clear graphics PCB manufacturing performance.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	9μm	12μm	18μm	35μm	70μm	105μm
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	153±5	283±7	585±10	875±15
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15			≥18	≥20
Elongation	R.T.(23℃)	%	≥5.0		≥6.0	≥10
	H.T.(180℃)		≥6.0			≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤3.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.9	≥1.0	≥1.5	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		—-	None
Pinhole		EA	Zero
Size Tolerance	Width	mm	0~2mm
	Length	mm	—-
Core		Mm/inch	Inside Diameter 79mm/3 inch

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

Product detail pictures:

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We keep on with the basic principle of "quality to start with, support very first, continuous improvement and innovation to meet the customers" for your management and "zero defect, zero complaints" as the quality objective. To great our service, we offer the items with all the superior top quality at the reasonable selling price for OEM/ODM Factory Circuit Foil - VLP ED Copper Foils – CIVEN , The product will supply to all over the world, such as: Qatar, United States, kazan, They are sturdy modeling and promoting effectively all over the world. Never ever disappearing major functions within a quick time, it's a have to for you of fantastic good quality. Guided by the principle of "Prudence, Efficiency, Union and Innovation. the corporation. ake an excellent efforts to expand its international trade, raise its organization. rofit and raise its export scale. We are confident that we are going to have a bright prospect and to be distributed all over the world in the years to come.

Copper Foil Density