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OEM/ODM China Electrodeposited Copper Foil - ED Copper Foils for FPC – CIVEN

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Quality comes first; service is foremost; business is cooperation" is our business philosophy which is constantly observed and pursued by our company for Emi Shielding Foil, Calendering Copper Foil, Copper Shielding Tape, The continual availability of high grade products in combination with our excellent pre- and after-sales service ensures strong competitiveness in an increasingly globalized market.
OEM/ODM China Electrodeposited Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


Product detail pictures:

OEM/ODM China Electrodeposited Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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Generally customer-oriented, and it's our ultimate goal for being not only the most trusted, trustable and honest provider, but also the partner for our customers for OEM/ODM China Electrodeposited Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Colombia, Anguilla, Montreal, With all these supports, we can serve every customer with quality product and timely shipping with highly responsibility. Being a young growing company, we might not the best, but we are trying our best to be your good partner.
  • We have been appreciated the Chinese manufacturing, this time also did not let us disappoint,good job!
    5 Stars By Nicola from Vietnam - 2018.09.21 11:01
    We have been engaged in this industry for many years, we appreciate the work attitude and production capacity of the company, this is a reputable and professional manufacturer.
    5 Stars By Janice from French - 2017.05.02 11:33
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