OEM manufacturer Hte Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN
OEM manufacturer Hte Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:
Product Introduction
The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.
Specifications
Thickness: 1/4OZ～20OZ(9µm～70µm)
Width: 550mm ～1295mm
Performance
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
Applications
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.
Advantages
The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.
Performance(GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
|
Cu Content |
% |
≥99.8 |
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|
Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
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|
H.T.(180℃) |
≥15 |
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|
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
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|
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
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|
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
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|
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
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|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
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|
Change of color(E-1.0hr/190℃) |
% |
Good |
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|
Solder Floating 290℃ |
Sec. |
≥20 |
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|
Pinhole |
EA |
Zero |
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|
Preperg |
—- |
FR-4 |
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Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
Bear "Customer first, High quality first" in mind, we perform closely with our consumers and provide them with efficient and experienced services for OEM manufacturer Hte Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Lesotho, Puerto Rico, Oman, We expect to deliver merchandise and services to more users in global aftermarket markets; we launched our global branding strategy by providing our excellent products and solutions all over the world by virtue of our well reputed partners letting global users keep pace with technology innovation and achievements with us.
By Lulu from panama - 2018.08.12 12:27
The customer service staff's attitude is very sincere and the reply is timely and very detailed, this is very helpful for our deal,thank you.
By Betsy from India - 2017.06.19 13:51
