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OEM Manufacturer Cu-Ni Foil - ED Copper Foils for FPC – CIVEN

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We attempt for excellence, provider the customers", hopes to be the most beneficial cooperation team and dominator enterprise for staff, suppliers and shoppers, realizes value share and continuous advertising for Bronze Foil, Nickel Plated Copper Sheet, Thin Copper Foil Tape, We have now designed a reputable track record among many shoppers. Quality&customer initially are normally our constant pursuit. We spare no attempts to produce greater solutions. Stay up for long-term cooperation and mutual positive aspects!
OEM Manufacturer Cu-Ni Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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OEM Manufacturer Cu-Ni Foil - ED Copper Foils for FPC – CIVEN detail pictures


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We know that we only thrive if we can guarantee our combined price competiveness and quality advantageous at the same time for OEM Manufacturer Cu-Ni Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Lithuania, Philippines, Poland, we are now looking forward to even greater cooperation with overseas customers based on mutual benefits. We will work wholeheartedly to improve our products and services. We also promise to work jointly with business partners to elevate our cooperation to a higher level and share success together. Warmly welcome you to visit our factory sincerely.
  • The goods are very perfect and the company sales manager is warmful, we will come to this company to purchase next time.
    5 Stars By Chris from Finland - 2018.07.27 12:26
    High production efficiency and good product quality, fast delivery and completed after-sale protection, a right choice, a best choice.
    5 Stars By Doreen from Kenya - 2017.02.14 13:19
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