OEM manufacturer Copper Tape Emi Shielding - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Persisting in "High top quality, Prompt Delivery, Aggressive Price", now we have established long-term cooperation with customers from the two overseas and domestically and get new and aged clients' large comments for Thin Brass Strips, Reverse Treat Foil, Tinned Copper Strip, Our company insists on innovation to promote the sustainable development of enterprise, and make us become the domestic high-quality suppliers.

OEM manufacturer Copper Tape Emi Shielding - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ～20OZ(9µm～70µm)

Width: 550mm ～1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	1/4OZ (9μm)	1/3OZ (12μm)	J OZ (15μm)	1/2OZ (18μm)	1OZ (35μm)	2OZ (70μm)
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	127±4	153±5	283±5	585±10
Tensile Strength	R.T.(25℃)	Kg/mm²	≥28	≥30
	H.T.(180℃)		≥15
Elongation	R.T.(25℃)	%	≥4.0	≥5.0	≥6.0		≥10
	H.T.(180℃)		≥4.0		≥5.0	≥6.0
Roughness	Shiny(Ra)	μm	≤0.4
	Matte(Rz)		≤5.0	≤6.0	≤7.0	≤7.0	≤9.0	≤14
Peel Strength	R.T.(23℃)	Kg/cm	≥1.0	≥1.2	≥1.2	≥1.3	≥1.8	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤5.0
Change of color(E-1.0hr/190℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Pinhole		EA	Zero
Preperg		—-	FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

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Our company since its inception, constantly regards product or service high quality as business life, continually improve creation technology, make improvements to product high-quality and consistently strengthen business total high-quality management, in strict accordance together with the national standard ISO 9001:2000 for OEM manufacturer Copper Tape Emi Shielding - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Brasilia, Switzerland, Albania, Our company regards "reasonable prices, high quality,efficient production time and good after-sales service" as our tenet. We hope to cooperate with more customers for mutual development and benefits in future. Welcome to contact us.

Copper Tape Emi Shielding