New Delivery for Plate Heat Exchange Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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"Control the standard by the details, show the toughness by quality". Our firm has strived to establish a highly efficient and stable workers workforce and explored an effective high-quality management system for Calendering Copper Foil, Copper Strip Tape, Calendered Copper Foil, Base on the business concept of Quality first, we would like to meet more and more friends in the word and we hope provide the best product and service to you.

New Delivery for Plate Heat Exchange Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ～20OZ(9µm～70µm)

Width: 550mm ～1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	1/4OZ (9μm)	1/3OZ (12μm)	J OZ (15μm)	1/2OZ (18μm)	1OZ (35μm)	2OZ (70μm)
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	127±4	153±5	283±5	585±10
Tensile Strength	R.T.(25℃)	Kg/mm²	≥28	≥30
	H.T.(180℃)		≥15
Elongation	R.T.(25℃)	%	≥4.0	≥5.0	≥6.0		≥10
	H.T.(180℃)		≥4.0		≥5.0	≥6.0
Roughness	Shiny(Ra)	μm	≤0.4
	Matte(Rz)		≤5.0	≤6.0	≤7.0	≤7.0	≤9.0	≤14
Peel Strength	R.T.(23℃)	Kg/cm	≥1.0	≥1.2	≥1.2	≥1.3	≥1.8	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤5.0
Change of color(E-1.0hr/190℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Pinhole		EA	Zero
Preperg		—-	FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

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Our primary objective is usually to offer our shoppers a serious and responsible small business relationship, offering personalized attention to all of them for New Delivery for Plate Heat Exchange Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Jeddah, Amman, Croatia, We've more than 10 years exported experience and our products and solutions have expored more than 30 countries around the word . We always hold the service tenet Client first,Quality first in our mind,and are strict with product quality. Welcome your visiting!

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