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New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN

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With reliable good quality system, great standing and perfect consumer support, the series of products and solutions produced by our organization are exported to quite a few countries and regions for Lightning Protection Copper Tape, Copper Tape Emi Shielding, Tin Plated Copper Foil, Seeing believes! We sincerely welcome the new clients abroad to build organization associations and also hope to consolidate the associations while using the long-established prospects.
New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


Product detail pictures:

New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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As for competitive prices, we believe that you will be searching far and wide for anything that can beat us. We can state with absolute certainty that for such quality at such prices we are the lowest around for New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Tunisia, Istanbul, Nigeria, The company has perfect management system and after-sales service system. We devote ourselves to building a pioneer in the filter industry. Our factory is willing to cooperate with different customers domestic and overseas to gain better and better future.
  • Superb technology, perfect after-sales service and efficient work efficiency, we think this is our best choice.
    5 Stars By Poppy from Norwegian - 2018.11.22 12:28
    The supplier cooperation attitude is very good, encountered various problems, always willing to cooperate with us, to us as the real God.
    5 Stars By Roxanne from Muscat - 2018.06.09 12:42
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