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New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN

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Our solutions are widely regarded and trustworthy by consumers and may meet continually modifying financial and social requirements for Copper Foil Tape With Conductive Adhesive, Copper Tape Conductive Adhesive, High Temperature And Elongation Copper Foil, We welcome new and aged buyers from all walks of lifetime to make contact with us for potential small business associations and mutual success!
New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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owing to excellent assistance, a variety of high quality products and solutions, aggressive costs and efficient delivery, we take pleasure in an excellent popularity amongst our customers. We are an energetic business with wide market for New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Sydney, Durban, Jordan, We welcome you to visit our company and factory. It is also convenient to visit our website. Our sales team will offer you the best service. If you need more information, please feel free to contact us by E-mail or telephone. We are sincerely hope to establish a good long-term business relationship with you through this opportunity, based on equal, mutual benefit from now till the future.
  • The sales person is professional and responsible, warm and polite, we had a pleasant conversation and no language barriers on communication.
    5 Stars By Mario from Nairobi - 2018.09.21 11:44
    The sales manager is very patient, we communicated about three days before we decided to cooperate, finally, we are very satisfied with this cooperation!
    5 Stars By Lena from Mongolia - 2017.07.28 15:46
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