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New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN

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Our firm since its inception, normally regards item top quality as company life, constantly make improvements to generation technology, improve product excellent and repeatedly strengthen organization total good quality management, in strict accordance with the national standard ISO 9001:2000 for Copper Insulation Tape, Nickel Copper Foil, Brass Foil, We promise to try our greatest to deliver you with high quality and economical products and services.
New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


Product detail pictures:

New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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With our excellent administration, strong technical capability and strict excellent control method, we carry on to offer our clients with responsible good quality, reasonable costs and great companies. We intention at becoming considered one of your most responsible partners and earning your pleasure for New Delivery for Plate Heat Exchange Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Portland, Guatemala, Sao Paulo, Facing fierce global market competition, we have launched the brand building strategy and updated the spirit of "human-oriented and faithful service", with an aim to gain global recognition and sustainable development.
  • This is a reputable company, they have a high level of business management, good quality product and service, every cooperation is assured and delighted!
    5 Stars By Judy from Mauritius - 2018.09.19 18:37
    Problems can be quickly and effectively resolved, it is worth to be trust and working together.
    5 Stars By Dale from Muscat - 2017.03.08 14:45
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