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Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN

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To fulfill the customers' over-expected satisfaction , we have now our strong crew to provide our greatest general assistance which incorporates promoting, gross sales, planning, creation, top quality controlling, packing, warehousing and logistics for Copper Foil Paper, Thermal Conductive Foil, Copper Foil Sheet Adhesive Backed, We welcome buyers, business enterprise associations and good friends from all sections in the planet to get hold of us and request cooperation for mutual gains.
Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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To be the stage of realizing dreams of our employees! To build a happier, more united and more professional team! To reach a mutual benefit of our customers, suppliers, the society and ourselves for Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Kazakhstan, Ecuador, Greece, With excellent solutions, high quality service and sincere attitude of service, we ensure customer satisfaction and help customers create value for mutual benefit and create a win-win situation. Welcome customers all over the world to contact us or visit our company. We'll satisfy you with our qualified service!
  • Customer service staff and sales man are very patience and they all good at English, product's arrival is also very timely, a good supplier.
    5 Stars By Caroline from Durban - 2017.10.23 10:29
    Sales manager is very enthusiastic and professional, gave us a great concessions and product quality is very good,thank you very much!
    5 Stars By Bernice from Denver - 2017.12.19 11:10
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