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Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN

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Our solutions are widely recognized and trusted by consumers and will meet up with constantly developing financial and social requires for Copper Grounding Tape, Annealed Copper Foil, Argentan Foil, Our tenet is evident all of the time: to deliver high quality solution at competitive price tag to clients throughout the planet. We welcome potential customers to get in touch with us for OEM and ODM orders.
Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN detail pictures


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Attaining consumer satisfaction is our company's purpose without end. We will make wonderful endeavours to produce new and top-quality merchandise, satisfy your exclusive requirements and supply you with pre-sale, on-sale and after-sale services for Manufacturer of Bcf Copper Foil - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Denmark, Norwegian, Swedish, Furthermore, all of our products are manufactured with advanced equipment and strict QC procedures in order to ensure high quality. If you are interested in any of our products, please don't hesitate to contact us. We will do our best to meet your needs.
  • The customer service reprersentative explained very detailed, service attitude is very good, reply is very timely and comprehensive, a happy communication! We hope to have a opportunity to cooperate.
    5 Stars By Edwina from Vancouver - 2018.12.11 11:26
    The manufacturer gave us a big discount under the premise of ensuring the quality of products, thank you very much, we will select this company again.
    5 Stars By Jenny from Austria - 2018.08.12 12:27
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