Low price for Flexible Copper Clad Laminate - ED Copper Foils for FPC – CIVEN

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Along with the "Client-Oriented" enterprise philosophy, a rigorous high-quality control process, superior production products along with a robust R&D group, we constantly deliver premium quality products, exceptional solutions and aggressive costs for Low Profile Copper Foil, Copper Grounding Tape, Double Shiny Copper Foil, Good quality is the key factor for the company to stand out from other competitors. Seeing is Believing, want more information? Just trial on its products!

Low price for Flexible Copper Clad Laminate - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm～35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

SEM(Before Surface Treatment)

SEM(Shiny Side after Treatment)

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification		Unit	9μm	12μm	18μm	35μm
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	153±5	283±7
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15	≥15	≥15	≥18
Elongation	R.T.(23℃)	%	≥5.0	≥5.0	≥6.0	≥10
	H.T.(180℃)		≥6.0	≥6.0	≥8.0	≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤2.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.8	≥0.8
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		—-	None
Pinhole		EA	Zero
Size Tolerance	Width	mm	0~2mm
	Length	mm	—-
Core		Mm/inch	Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.

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We are convinced that with joint efforts, the business between us will bring us mutual benefits. We can assure you product quality and competitive price for Low price for Flexible Copper Clad Laminate - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Austria, Suriname, Seattle, Our company absorbs new ideas, strict quality control, a full range of service tracking, and adhere to make high-quality products. Our business aims to "honest and trustworthy, favorable price, customer first", so we won the trust of the majority of customers! If you are interested in our products and services, please do not hesitate to contact us!

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