Low MOQ for Flexible Printed Circuits Copper Foil - Super Thick ED Copper Foils – CIVEN

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Low MOQ for Flexible Printed Circuits Copper Foil - Super Thick ED Copper Foils – CIVEN Detail:

Product Introduction

The ultra-thick low-profile electrolytic copper foil produced by CIVEN METAL is not only customizable in terms of copper foil thickness, but also features low roughness and high separation strength, and the rough surface is not easy to fall off powder. We can also provide slicing service according to customers’ requirements.

Specifications

CIVEN can provide ultra-thick, low-profile, high-temperature ductile ultra-thick electrolytic copper foil (VLP-HTE-HF) from 3oz to 12oz (nominal thickness 105µm to 420µm), and the maximum product size is 1295mm x 1295mm sheet copper foil.

Performance

CIVEN provides ultra-thick electrolytic copper foil with excellent physical properties of equiaxial fine crystal, low profile, high strength and high elongation. (See Table 1)

Applications

Applicable to the manufacture of high-power circuit boards and high-frequency boards for automotive, electric power, communication, military and aerospace.

Characteristics

Comparison with similar foreign products.

● The grain structure of our VLP brand super-thick electrolytic copper foil is equiaxed fine crystal spherical; while the grain structure of similar foreign products is columnar and long.

● CIVEN ultra-thick electrolytic copper foil is ultra-low profile, 3oz copper foil gross surface Rz ≤ 3.5µm; while similar foreign products are standard profile, 3oz copper foil gross surface Rz > 3.5µm.

Advantages

● Since our product is ultra-low profile, it solves the potential risk of the line short circuit due to the large roughness of the standard thick copper foil and the easy penetration of the thin PP insulation sheet by the “wolf tooth” when pressing the double-sided panel.

● Because the grain structure of our products is equiaxed fine crystal spherical, it shortens the time of line etching and improves the problem of uneven line side etching.

● While having high peel strength, no copper powder transfer, clear graphics PCB manufacturing performance.

Table 1: Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	3oz	4oz	6oz	8oz	10oz	12oz
			105µm	140µm	210µm	280µm	315µm	420µm
Cu Content		%	≥99.8
Area Weigth		g/m²	915±45	1120±60	1830±90	2240±120	3050±150	3660±180
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15
Elongation	R.T.(23℃)	%	≥10			≥20
	H.T.(180℃)		≥5.0			≥10
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤10.1
Peel Strength	R.T.(23℃)	Kg/cm	≥1.1
Change of color(E-1.0hr/200℃)		%	Good
Pinhole		EA	Zero
Core		Mm/inch	Inside Diameter 79mm/3 inch

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

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