Low MOQ for Flexible Printed Circuits Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

Short Description:

Product Detail

Product Tags

Feedback (2)

From the past few years, our firm absorbed and digested sophisticated technologies equally at home and abroad. Meanwhile, our organization staffs a group of experts devoted into the growth of Flexible Copper Clad Laminate, Tinned Copper Sheet, Brass Moulding Strips, We honor our core principal of Honesty in business, priority in service and will do our best to offer our customers with high quality products and excellent service.

Low MOQ for Flexible Printed Circuits Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ～20OZ(9µm～70µm)

Width: 550mm ～1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	1/4OZ (9μm)	1/3OZ (12μm)	J OZ (15μm)	1/2OZ (18μm)	1OZ (35μm)	2OZ (70μm)
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	127±4	153±5	283±5	585±10
Tensile Strength	R.T.(25℃)	Kg/mm²	≥28	≥30
	H.T.(180℃)		≥15
Elongation	R.T.(25℃)	%	≥4.0	≥5.0	≥6.0		≥10
	H.T.(180℃)		≥4.0		≥5.0	≥6.0
Roughness	Shiny(Ra)	μm	≤0.4
	Matte(Rz)		≤5.0	≤6.0	≤7.0	≤7.0	≤9.0	≤14
Peel Strength	R.T.(23℃)	Kg/cm	≥1.0	≥1.2	≥1.2	≥1.3	≥1.8	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤5.0
Change of color(E-1.0hr/190℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Pinhole		EA	Zero
Preperg		—-	FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

Product detail pictures:

Related Product Guide:

Our firm since its inception, normally regards item top quality as company life, constantly make improvements to generation technology, improve product excellent and repeatedly strengthen organization total good quality management, in strict accordance with the national standard ISO 9001:2000 for Low MOQ for Flexible Printed Circuits Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Naples, Bulgaria, Salt Lake City, They're durable modeling and promoting effectively all over the world. Under no circumstances disappearing major functions in a quick time, it's a really should in your case of excellent good quality. Guided by the principle of "Prudence, Efficiency, Union and Innovation. the company make a terrific efforts to expand its international trade, raise its company profit and raise its export scale. We're confident that we've been planning to possess a vibrant prospect and to be distributed all over the world within the years to come.

Bare Copper Tape