Low MOQ for Flexible Printed Circuits Copper Foil - Copper Strip for Lead Frame – CIVEN

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Low MOQ for Flexible Printed Circuits Copper Foil - Copper Strip for Lead Frame – CIVEN Detail:

Product Introduction

The material for lead frame is always made from alloy of copper, Iron and phosphorus, or copper, nickel and silicon, which have the common alloy No. of C192(KFC),C194 and C7025.These alloys have high strength and performance.C194 and KFC are most representative for copper, iron and phosphorus alloy, they are the most common alloy materials.

C7025 is the alloy of copper and phosphorus, silicon. It has high thermal conductivity and high flexibility, and do not need heat treatment, also it’s easy for stamping. It has high strength, excellent thermal conductivity properties, and very suitable for lead frames, especially for assembly of high density integrated circuits.

Copper alloys for lead frames are roughly divided into copper iron system, copper nickel silicon system, copper chromium system, copper nickel tin system (jk-2 alloy), etc. ternary and quaternary copper alloys can achieve better performance and lower cost than traditional binary alloys. Copper iron alloys have the most brands and have better mechanical strength, stress relaxation resistance and low creep, It is a kind of good lead frame material. Due to the needs of lead frame fabrication and packaging applications, in addition to high strength and high thermal conductivity, the materials are also required to have good brazing performance, process performance, etching performance, oxide film bonding performance, etc. The materials are developing in the direction of high strength, high conductivity and low cost. A small amount of various elements are added to copper to improve the alloy strength (so that the lead frame is not easy to deform) and comprehensive properties without significantly reducing the conductivity. The materials with tensile strength above 600MPa and conductivity greater than 80% IACS are the research and development hotspot. The copper strip is required to be high surface, accurate plate shape, uniform performance, continuous thinning of strip thickness, gradual thinning from 0.25mm to o.15mm and 0.lmm, and ultra-thin and profiled of 0.07-0.qiao.

Main Technical Parameters

Chemical composition

Name	Alloy No.	Chemical Composition(%)
Name	Alloy No.	Fe	P	Ni	Si	Mg	Cu
Copper-Iron-Phosphorus Alloy	QFe0.1/C192/KFC	0.05-0.15	0.015-0.04	—	—	—	Rem
Copper-Iron-Phosphorus Alloy	QFe2.5/C194	2.1-2.6	0.015-0.15	—	—	—	Rem
Copper-Nickel-Silicon Alloy	C7025	—–	—–	2.2-4.2	0.25-1.2	0.05-0.3	Rem

Technical Parameters

Alloy No.	Temper	Mechanical properties
Alloy No.	Temper	Tensile Strength MPa	Elongation δ≥(%)	Hardness HV	Elctricity Conductivity ％IACS	Thermal Conductivity W/（m.K）
C192/KFC/C19210	O	260-340	≥30	＜100	85	365
	1/2H	290-440	≥15	100-140
	H	340-540	≥4	110-170
C194/C19410	1/2H	360-430	≥5	110-140	60	260
	H	420-490	≥2	120-150
	EH	460-590	—-	140-170
	SH	≥550	—-	≥160
C7025	TM02	640-750	≥10	180-240	45	180
	TM03	680-780	≥5	200-250
	TM04	770-840	≥1	230-275

Note: Above figures based on the material thickness 0.1~3.0mm.

Typical Applications

● Lead frame for Integrated Circuits, Electrical connectors, Transistors, LED stents.

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