Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN

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Our target should be to consolidate and enhance the top quality and service of current goods, in the meantime frequently create new products to satisfy diverse customers' calls for for Emi Shielding Foil, Conductive Tape, Nickel Plated Copper Foil, We have a big inventory to fulfill our customer's requires and needs.

Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN Detail:

Product Introduction

Copper Sheet is made of electrolytic copper, through processing by ingot, hot rolling, cold rolling, heat treatment, surface cleaning, cutting, finishing, and then packing. The material has excellent thermal and electrical conduction, flexible ductility and good corrosion resistance. It has been widely used in electrical, automotive, communications, hardware, decoration and other industries.

Main Technical Parameters

1-1 Chemical Composition

Alloy No.	Chemical Composition (%，Max.)
Alloy No.	Cu+Ag	P	Bi	Sb	As	Fe	Ni	Pb	Sn	S	Zn	O	Impurity
T1	99.95	0.001	0.001	0.002	0.002	0.005	0.002	0.003	0.002	0.005	0.005	0.02	0.05
T2	99.90	—	0.001	0.002	0.002	0.005	0.005	0.005	0.002	0.005	0.005	0.06	0.1
TU1	99.97	0.002	0.001	0.002	0.002	0.004	0.002	0.003	0.002	0.004	0.003	0.002	0.03
TU2	99.95	0.002	0.001	0.002	0.002	0.004	0.002	0.004	0.002	0.004	0.003	0.003	0.05
TP1	99.90	—	0.002	0.002	—	0.01	0.004	0.005	0.002	0.005	0.005	0.01	0.1
TP2	99.85	—	0.002	0.002	—	0.05	0.01	0.005	0.01	0.005	—	0.01	0.15

1-2 Alloy Table

Name	China	ISO	ASTM	JIS
Pure Copper	T1,T2	Cu-FRHC	C11000	C1100
oxygen-free copper	TU1	——	C10100	C1011
oxygen-free copper	TU2	Cu-OF	C10200	C1020
deoxidized copper	TP1	Cu-DLP	C12000	C1201
deoxidized copper	TP2	Cu-DHP	C12200	C1220

1-3 Features

1-3-1Specification mm

Name	Alloy(China)	Temper	Size(mm)
			Thickness	Width	Length
Copper Sheet	T2/TU2	H 1/4H 1/2H H	0.3～0.49	600	1000～2000
			0.5～3.0	600～1000	1000～3000

Temper Mark:O. Soft;1/4H. 1/4 Hard;1/2H. 1/2 Hard;H. Hard;EH. Ultrahard;R. Hot Rolled.

1-3-2 Tolerance Unit: mm

Thickness	Width
	Thickness Allow Deviation±			Width Allow Deviation±
	<400	<600	<1000	<400	<600	<1000
0.5~0.8	0.035	0.050	0.080	0.3	0.3	1.5
0.8~1.2	0.040	0.060	0.090	0.3	0.5	1.5
1.2~2.0	0.050	0.080	0.100	0.3	0.5	2.5
2.0~3.2	0.060	0.100	0.120	0.5	0.5	2.5

1-3-3 Mechanical Performance:

Alloy		Temper		Tensile Strength N/mm2	Elongation ≥%	Hardness HV
T1	T2	M	(O)	205-255	30	50-65
TU1	TU2	Y4	(1/4H)	225-275	25	55-85
TP1	TP2	Y2	(1/2H)	245-315	10	75-120
		Y	(H)	≥275	3	≥90

Temper Mark:O. Soft;1/4H. 1/4 Hard;1/2H. 1/2 Hard;H. Hard;EH. Ultrahard;R. Hot Rolled.

1-3-4 Electrical Parameters:

Alloy	Conductivity/%IACS	Resistance Coefficient /Ωmm2/m
T1 T2	≥98	0.017593
TU1 TU2	≥100	0.017241
TP1 TP2	≥90	0.019156

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Our commission is to serve our buyers and purchasers with most effective good quality and aggressive portable digital goods for Low MOQ for Flexible Printed Circuits Copper Foil - Copper Sheet – CIVEN , The product will supply to all over the world, such as: Japan, Serbia, South Africa, We welcome you to visit our company, factory and our showroom displayed various products that will meet your expectation, meanwhile, it is convenient to visit our website, our sales staff will try their efforts to offer you the best service. If you need to have more information, remember to do not hesitate to contact us by E-mail or telephone.

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