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Leading Manufacturer for Graphene Copper Foil - RTF ED Copper Foil – CIVEN

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Leading Manufacturer for Graphene Copper Foil - RTF ED Copper Foil – CIVEN Detail:

Product Introduction

Reverse treated electrolytic copper foil (RTF) is a copper foil that has been roughened to varying degrees on both sides. This strengthens the peel strength of both sides of the copper foil, making it easier to use as an intermediate layer for bonding to other materials. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.

Specifications

CIVEN can supply RTF electrolytic copper foil with nominal thickness of 12 to 35µm up to 1295mm width.

Performance

The high temperature elongation reversed treated electrolytic copper foil is subjected to a precise plating process to control the size of the copper tumors and distribute them evenly. The reversed treated bright surface of the copper foil can significantly reduce the roughness of the copper foil pressed together and provide sufficient peel strength of the copper foil. (See Table 1)

Applications

Can be used for high-frequency products and inner laminates, such as 5G base stations and automotive radar and other equipment.

Advantages

Good bonding strength, direct multi-layer lamination, and good etching performance. It also reduces the potential for short circuit and shortens the process cycle time.

Table 1. Performance

Classification

Unit

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Cu Content

%

min. 99.8

Area Weigth

g/m2

107±3

153±5

283±5

Tensile Strength

R.T.(25℃)

Kg/mm2

min. 28.0

H.T.(180℃)

min. 15.0

min. 15.0

min. 18.0

Elongation

R.T.(25℃)

%

min. 5.0

min. 6.0

min. 8.0

H.T.(180℃)

min. 6.0

Roughness

Shiny(Ra)

μm

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Matte(Rz)

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Peel Strength

R.T.(23℃)

Kg/cm

min. 1.1

min. 1.2

min. 1.5

Degraded rate of HCΦ(18%-1hr/25℃)

%

max. 5.0

Change of color(E-1.0hr/190℃)

%

None

Solder Floating 290℃

Sec.

max. 20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


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Leading Manufacturer for Graphene Copper Foil - RTF ED Copper Foil – CIVEN detail pictures


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Our advancement depends over the highly developed devices, excellent talents and continually strengthened technology forces for Leading Manufacturer for Graphene Copper Foil - RTF ED Copper Foil – CIVEN , The product will supply to all over the world, such as: Morocco, Cologne, Estonia, We only supply quality products and we believe this is the only way to keep business continue. We can supply custom service too such as Logo, custom size, or custom products etc that can according to customer's requirement.
  • We are old friends, the company's product quality has been always very good and this time the price is also very cheap.
    5 Stars By Lee from Nepal - 2018.09.12 17:18
    Cooperate with you every time is very successful, very happy. Hope that we can have more cooperation!
    5 Stars By Margaret from Russia - 2017.10.25 15:53
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