Good quality Thin Nickel Foil - 3L Flexible Copper Clad Laminate – CIVEN

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Good quality Thin Nickel Foil - 3L Flexible Copper Clad Laminate – CIVEN Detail:

Product Introduction

In addition to the advantages of thin, light and flexible, FCCL with polyimide based film also has excellent electrical properties, thermal properties, and heat resistance characteristics. Its low dielectric constant (DK) makes electrical signals transmit rapidly. Good thermal performance makes the components easy to cool down. The higher glass transition temperature (Tg) allows the components to operate well at higher temperatures. Since most of the products of FCCL are provided to users in continuous roll form, therefore, the use of FCCL in the production of printed circuit boards is beneficial to the realization of automatic continuous production of FPC and the continuous surface installation of components on FPC.

Flexible copper clad laminate (also known as flexible copper clad laminate) is the processing substrate material of flexible printed circuit board. It is composed of flexible insulating base film and metal foil. The flexible copper clad laminate composed of copper foil, film and adhesive is called three-layer flexible copper clad laminate (3l-fccl for short). The flexible copper clad laminate without adhesive is called two-layer flexible copper clad laminate (2L-FCCL for short)

Flexible copper clad laminate (FCCL) has the characteristics of thin, light and flexible compared with rigid copper clad laminate. FPC with FCCL as substrate material is widely used in mobile phones, digital cameras, digital cameras, automotive satellite orientation devices, LCD TVs, laptops and other electronic products.

Specifications

Product name	Product code	Structure
3L FCCL	MG3L 181513	18μm Copper foil \| 15μm EPOXY Adhesive \| 13μm PI film
3L FCCL	MG3L 181313	18μm Copper foil \| 13μm EPOXY Adhesive \| 13μm PI film
Multilayer FCCL	MG3LTC 352025	35μm Copper foil \| 20μm EPOXY Adhesive \| 25μm PI film \| 20μm EPOXY Adhesive \| 35μm Copper foil
Multilayer FCCL	MG3LTC 121513	12μm Copper foil \| 15μm EPOXY Adhesive \| 13μm PI film \| 15μm EPOXY Adhesive \| 12μm Copper foil

Product Performance

● Excellent peel resistance

● Excellent heat resistance

● Good dimensional stability

● Excellent mechanical and electrical properties

● Flame retardant UL94V-0/VTM-0

● Meet the RoHS directive requirements, free of lead (Pb), mercury (Hg), cadmium (GR), hexavalent chromium (Cr), polybrominated biphenyls, polybrominated biphenyls, etc

Product Application

Mainly used in computers, notebook computers, mobile phones and antennas, backlight modules, flat panel display, capacitive screen, digital cameras, cameras, printers, instruments and meters, automotive electronics, automotive audio, automotive, Note Book connectors, Harmony Bus and other high-end electronic products.

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