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Fast delivery Flexible Copper-Cladded Laminate - ED Copper Foils for FPC – CIVEN

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With this motto in mind, we have turn out to be amongst probably the most technologically innovative, cost-efficient, and price-competitive manufacturers for Copper Grounding Tape, High-Purity Copper Foil, Ra Copper Foil, We're prepared to present you with the most effective ideas over the designs of the orders in a qualified way for those who need. While in the meantime, we continue to keep on producing new technologies and building new designs so as to help make you ahead from the line of this small business.
Fast delivery Flexible Copper-Cladded Laminate - ED Copper Foils for FPC – CIVEN Detail:

Product Introduction

Electrolytic copper foil for FPC is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

Dimension Range

Thickness: 9µm~35µm

Performances

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

High density, high bending resistance and good etching performance.

Microstructure

1

SEM(Before Surface Treatment)

2

SEM(Shiny Side after Treatment)

3

SEM(Rough Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000)

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23℃)

Kg/mm2

≥28

H.T.(180℃)

≥15

≥15

≥15

≥18

Elongation

R.T.(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤7.0

Change of color(E-1.0hr/200℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Appearance(Spot and copper powder)

—-

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

—-

Core

Mm/inch

Inside Diameter 79mm/3 inch

Note: 1. Copper foil oxidation resistance performance and surface density index can be negotiated.

2. The performance index is subject to our testing method.

3. The quality guarantee period is 90 days from the date of receipt.


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Fast delivery Flexible Copper-Cladded Laminate - ED Copper Foils for FPC – CIVEN detail pictures


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Our company sticks into the basic principle of "Quality is definitely the life of the business, and status may be the soul of it" for Fast delivery Flexible Copper-Cladded Laminate - ED Copper Foils for FPC – CIVEN , The product will supply to all over the world, such as: Zimbabwe, Uruguay, Argentina, We are confident that we are able to provide you with opportunities and will be a valuable business partner of you. We look forward to working with you soon. Learn more about the types of products that we work with or contact us now directly with your inquiries. You are welcome to contact us anytime!
  • We are a small company that has just started, but we get the company leader's attention and gave us a lot of help. Hope we can make progress together!
    5 Stars By Jill from Malta - 2018.09.19 18:37
    The factory can meet continuously developing economic and market needs, so that their products are widely recognized and trusted, and that's why we chose this company.
    5 Stars By Ivy from Hungary - 2018.04.25 16:46
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