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Factory wholesale Die-Cutting Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Factory wholesale Die-Cutting Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


Product detail pictures:

Factory wholesale Die-Cutting Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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With our loaded encounter and considerate services, we have now been recognized as a trustworthy supplier for lots of worldwide consumers for Factory wholesale Die-Cutting Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Dubai, Boston, Malaysia, Thus far, our item associated with printer dtg a4 may be shown in most foreign nations as well as urban centers, which are sought after simply by targeted traffic. We all highly imagine that now we have the full capacity to present you with contented merchandise. Desire to collect requests of your stuff and produce the long-term co-operation partnership. We very seriously promise:Csame top quality, better price; exact same selling price, higher quality.
  • The company can think what our think, the urgency of urgency to act in the interests of our position, can be said this is a responsible company, we had a happy cooperation!
    5 Stars By Linda from Germany - 2017.12.19 11:10
    The factory workers have a good team spirit, so we received high quality products fast, in addition, the price is also appropriate, this is a very good and reliable Chinese manufacturers.
    5 Stars By Kim from Johor - 2017.09.09 10:18
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