ED Copper Foils for FPC

Short Description:

FCF, flexible copper foil is specially developed and manufactured for the FPC industry (FCCL). This electrolytic copper foil has better ductility, lower roughness and better peel strength than other copper foils. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance is also better than similar copper foil products. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

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Product Detail

Product Tags

Product Introduction

Dimension Range:

Thickness: 9µm～35µm

Performance

The product surface is black or red, has lower surface roughness.

Applications

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features:

High density, high bending resistance and good etching performance.

Microstructure:

SEM(Rough Side after Treatment)

SEM(Before Surface Treatment)

SEM(Shiny Side after Treatment)

Table1- Performance (GB/T5230-2000、IPC-4562-2000):

Classification		Unit	9μm	12μm	18μm	35μm
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	153±5	283±7
Tensile Strength	R.T.(23℃)	Kg/mm²	≥28
	H.T.(180℃)		≥15	≥15	≥15	≥18
Elongation	R.T.(23℃)	%	≥5.0	≥5.0	≥6.0	≥10
	H.T.(180℃)		≥6.0	≥6.0	≥8.0	≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤2.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.8	≥0.8
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		----	None
Pinhole		EA	Zero
Size Tolerance	Width	mm	0~2mm
	Length	mm	----
Core		Mm/inch	Inside Diameter 79mm/3 inch