Discountable price Circuit Board Copper Foil - Treated RA Copper Foil – CIVEN

Product Introduction

Treated RA copper foil is a single side roughened high precision copper foil in order to increase its peel strength. The roughened surface of copper foil likes a frosted texture, which makes it easier to laminate with other materials and less likely to peel off. There are two mainstream treatment methods: one is called reddening treatment, where the main ingredient is copper powder and the surface color is red after treatment; the other is blackening treatment, where the main ingredient is cobalt and nickel powder and the surface color is black after treatment. The treated RA copper foil produced by CIVEN METAL has the characteristics of stable thickness tolerance, no powder off out the roughened surface and good uniformity of copper buds. At the same time, CIVEN METAL also applies high-temperature anti-oxidation treatment on the shiny side of the treated RA copper foil to prevent the material from color changing at high temperatures during client processing. This type of copper foil is manufactured and packaged in a dust free room to ensure the cleanliness of the material, making it more suitable for high-end electronic material processing. CIVEN METAL can also customize the production according to customer requirements to better meet the their demanding on high-end materials.

Dimension Range

● Thickness range: 12～70 µm (1/3 to 2 OZ)

● Width Range: 150 ~ 600 mm (5.9 to 23.6 inch)

Performances

● High flexibility and extensibility

● Even and smooth surface

● Good fatigue resistance

● Strong antioxidant properties

● Good mechanical properties

Applications

Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features

The material has higher extensibility, and has a high bending resistance and no crack.