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Discountable price Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Discountable price Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


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Discountable price Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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With our leading technology at the same time as our spirit of innovation,mutual cooperation, benefits and development, we are going to build a prosperous future alongside one another with your esteemed enterprise for Discountable price Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Austria, Malta, Bulgaria, Meanwhile, we're building up and consummating triangle market & strategic cooperation in order to achieve a multi-win trade supply chain to expand our market vertically and horizontally for a brighter prospects. development. Our philosophy is to create cost-effective products and solutions, promote perfect services, cooperate for long-term and mutual benefits, firm a in depth mode of excellent suppliers system and marketing agents, brand strategic cooperation sales system.
  • Wide range, good quality, reasonable prices and good service, advanced equipment, excellent talents and continuously strengthened technology forces,a nice business partner.
    5 Stars By Karen from azerbaijan - 2018.05.15 10:52
    The company account manager has a wealth of industry knowledge and experience, he could provide appropriate program according our needs and speak English fluently.
    5 Stars By Olivia from Portland - 2018.05.15 10:52
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