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Copper Strip for Lead Frame

Short Description:

The material for lead frame is always made from alloy of copper, Iron and phosphorus, or copper, nickel and silicon, which have the common alloy No. of C192(KFC),C194 and C7025.These alloys have high strength and performance.


Product Detail

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Product Introduction

The material for lead frame is always made from alloy of copper, Iron and phosphorus, or copper, nickel and silicon, which have the common alloy No. of C192(KFC),C194 and C7025.These alloys have high strength and performance.C194 and KFC are most representative for copper, iron and phosphorus alloy, they are the most common alloy materials.

C7025 is the alloy of copper and phosphorus, silicon. It has high thermal conductivity and high flexibility, and do not need heat treatment, also it’s easy for stamping. It has high strength, excellent thermal conductivity properties, and very suitable for lead frames, especially for assembly of high density integrated circuits.

Main Technical Parameters

Chemical composition

Name

Alloy No.

Chemical Composition(%)

Fe

P

Ni

Si

Mg

Cu

Copper-Iron-Phosphorus

Alloy

QFe0.1/C192/KFC

0.05-0.15

0.015-0.04

---

---

---

Rem

QFe2.5/C194

2.1-2.6

0.015-0.15

---

---

---

Rem

Copper-Nickel-Silicon

Alloy

C7025

-----

-----

2.2-4.2

0.25-1.2

0.05-0.3

Rem

 Technical Parameters

Alloy No.

Temper

Mechanical properties

Tensile Strength
MPa

Elongation
δ≥(%)

Hardness
HV

Elctricity Conductivity
%IACS

Thermal Conductivity

W/(m.K)

C192/KFC/C19210

O

260-340

≥30

<100

85

365

1/2H

290-440

≥15

100-140

H

340-540

≥4

110-170

C194/C19410

1/2H

360-430

≥5

110-140

60

260

H

420-490

≥2

120-150

EH

460-590

----

140-170

SH

≥550

----

≥160

C7025

TM02

640-750

≥10

180-240

45

180

TM03

680-780

≥5

200-250

TM04

770-840

≥1

230-275

Note: Above figures based on the material thickness 0.1~3.0mm.

Typical Applications

● Lead frame for Integrated Circuits, Electrical connectors, Transistors, LED stents.


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