Copper Foil for Copper Clad Laminate

Copper Clad Laminate (CCL) is an electronic fiberglass cloth or other reinforcing material impregnated with resin, one or both sides are covered with copper foil and heat pressed to make a board material, referred to as copper-clad laminate. Various different forms and functions of printed circuit boards are selectively processed, etched, drilled and copper plated on the copper-clad board to make different printed circuits. The printed circuit board mainly plays the role of interconnection conduction, insulation and support, and has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost and long-term reliability and stability of the printed circuit board depend largely on the copper clad board. The copper foil for copper clad boards produced by CIVEN METAL is the ideal material for copper clad boards, which has the characteristics of high purity, high elongation, flat surface, high precision and easy etching. At the same time, MCIVEN METAL can also provide both rolled and sheet copper foil materials according to customer requirements.