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Competitive Price for High Flex Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Competitive Price for High Flex Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


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Competitive Price for High Flex Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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Our organization has been focusing on brand strategy. Customers' gratification is our greatest advertising. We also source OEM provider for Competitive Price for High Flex Circuit Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Moldova, India, Madrid, To let customers be more confident in us and get the most comfortable service, we run our company with honesty, sincerity and best quality . We firmly believe that it is our pleasure to help customers to run their business more successfully, and that our professional advice and service can lead to more suitable choice for the customers.
  • The company leader recept us warmly, through a meticulous and thorough discussion, we signed a purchase order. Hope to cooperate smoothly
    5 Stars By olivier musset from Italy - 2018.07.27 12:26
    The goods are very perfect and the company sales manager is warmful, we will come to this company to purchase next time.
    5 Stars By Christine from The Swiss - 2018.06.21 17:11
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