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Big discounting 5g Copper Foil - RTF ED Copper Foil – CIVEN

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Big discounting 5g Copper Foil - RTF ED Copper Foil – CIVEN Detail:

Product Introduction

Reverse treated electrolytic copper foil (RTF) is a copper foil that has been roughened to varying degrees on both sides. This strengthens the peel strength of both sides of the copper foil, making it easier to use as an intermediate layer for bonding to other materials. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.

Specifications

CIVEN can supply RTF electrolytic copper foil with nominal thickness of 12 to 35µm up to 1295mm width.

Performance

The high temperature elongation reversed treated electrolytic copper foil is subjected to a precise plating process to control the size of the copper tumors and distribute them evenly. The reversed treated bright surface of the copper foil can significantly reduce the roughness of the copper foil pressed together and provide sufficient peel strength of the copper foil. (See Table 1)

Applications

Can be used for high-frequency products and inner laminates, such as 5G base stations and automotive radar and other equipment.

Advantages

Good bonding strength, direct multi-layer lamination, and good etching performance. It also reduces the potential for short circuit and shortens the process cycle time.

Table 1. Performance

Classification

Unit

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Cu Content

%

min. 99.8

Area Weigth

g/m2

107±3

153±5

283±5

Tensile Strength

R.T.(25℃)

Kg/mm2

min. 28.0

H.T.(180℃)

min. 15.0

min. 15.0

min. 18.0

Elongation

R.T.(25℃)

%

min. 5.0

min. 6.0

min. 8.0

H.T.(180℃)

min. 6.0

Roughness

Shiny(Ra)

μm

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Matte(Rz)

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Peel Strength

R.T.(23℃)

Kg/cm

min. 1.1

min. 1.2

min. 1.5

Degraded rate of HCΦ(18%-1hr/25℃)

%

max. 5.0

Change of color(E-1.0hr/190℃)

%

None

Solder Floating 290℃

Sec.

max. 20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


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The client satisfaction is our primary concentrate on. We uphold a consistent level of professionalism, top quality, credibility and service for Big discounting 5g Copper Foil - RTF ED Copper Foil – CIVEN , The product will supply to all over the world, such as: Algeria, Seattle, Rotterdam, We accomplish this by exporting our wigs directly from our own factory to you. The goal of our company is to get customers who enjoy coming back to their business. We sincerely hope to cooperate with you in the near future. If there's any opportunity, welcome to visit our factory!!!
  • Cooperate with you every time is very successful, very happy. Hope that we can have more cooperation!
    5 Stars By Hulda from Israel - 2017.01.28 18:53
    Product variety is complete, good quality and inexpensive, the delivery is fast and transport is security, very good, we are happy to cooperate with a reputable company!
    5 Stars By Jane from Congo - 2018.02.12 14:52
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