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Big Discount Printed Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Big Discount Printed Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ~20OZ(9µm~70µm)

Width: 550mm ~1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

—-

FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.


Product detail pictures:

Big Discount Printed Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN detail pictures


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Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" and the theory of "quality the basic, trust the first and management the advanced" for Big Discount Printed Board Copper Foil - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Swaziland, Guyana, Myanmar, Our company has abundant strength and possesses a steady and perfect sales network system. We wish we could establish sound business relationships with all customers from at home and abroad on the basis of mutual benefits.
  • Product variety is complete, good quality and inexpensive, the delivery is fast and transport is security, very good, we are happy to cooperate with a reputable company!
    5 Stars By Adela from Seychelles - 2017.12.02 14:11
    This company can be well to meet our needs on product quantity and delivery time, so we always choose them when we have procurement requirements.
    5 Stars By Victoria from Congo - 2017.03.07 13:42
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