8 Year Exporter Emi Copper Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN

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Which has a positive and progressive attitude to customer's desire, our corporation constantly improves our merchandise quality to satisfy the desires of consumers and further focuses on safety, reliability, environmental demands, and innovation of Copper Metal Foil, Bcf Copper Foil, High Flex Circuit Board Copper Foil, In our efforts, we already have many shops in China and our products have won praise from customers worldwide. Welcome new and old customers to contact us for the future long term business relationships.

8 Year Exporter Emi Copper Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:

Product Introduction

The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.

Specifications

Thickness: 1/4OZ～20OZ(9µm～70µm)

Width: 550mm ～1295mm

Performance

The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.

Applications

Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.

Advantages

The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.

Performance(GB/T5230-2000、IPC-4562-2000)

Classification		Unit	1/4OZ (9μm)	1/3OZ (12μm)	J OZ (15μm)	1/2OZ (18μm)	1OZ (35μm)	2OZ (70μm)
Cu Content		%	≥99.8
Area Weigth		g/m²	80±3	107±3	127±4	153±5	283±5	585±10
Tensile Strength	R.T.(25℃)	Kg/mm²	≥28	≥30
	H.T.(180℃)		≥15
Elongation	R.T.(25℃)	%	≥4.0	≥5.0	≥6.0		≥10
	H.T.(180℃)		≥4.0		≥5.0	≥6.0
Roughness	Shiny(Ra)	μm	≤0.4
	Matte(Rz)		≤5.0	≤6.0	≤7.0	≤7.0	≤9.0	≤14
Peel Strength	R.T.(23℃)	Kg/cm	≥1.0	≥1.2	≥1.2	≥1.3	≥1.8	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤5.0
Change of color(E-1.0hr/190℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Pinhole		EA	Zero
Preperg		—-	FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

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We always believe that one's character decides products' quality, the details decides products' quality ,with the REALISTIC,EFFICIENT AND INNOVATIVE team spirit for 8 Year Exporter Emi Copper Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Czech Republic, Ireland, Hungary, we are sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

This is a reputable company, they have a high level of business management, good quality product and service, every cooperation is assured and delighted!