2L Flexible Copper Clad Laminate
2L Flexible Copper Clad Laminate
CIVEN METAL's two-layer FCCL offers high conductivity, excellent thermal stability, and durability, maintaining stable performance even in high-temperature and harsh environments. Additionally, the material has outstanding flexibility and processability, making it suitable for complex circuit designs. The combination of high-quality copper foil and polyimide film ensures superior electrical performance and reliable long-term use.
Specifications
|
Product Name |
Cu Foil Type |
Structure |
|
MG2DB1003EH |
ED |
1/3 oz Cu | 1.0mil TPI | 1/3 oz Cu |
| MG2DB1005EH |
ED |
1/2 oz Cu | 1.0mil TPI | 1/2 oz Cu |
| MG2DF0803ER |
ED |
1/3 oz Cu | 0.8mil TPI | 1/3 oz Cu |
| MG2DF1003ER |
ED |
1/3 oz Cu | 1.0mil TPI | 1/3 oz Cu |
| MG2DF1005ER | ED | 1/2 oz Cu | 1.0mil TPI | 1/2 oz Cu |
| MG2DF1003RF | RA | 1/3 oz Cu | 1.0mil TPI | 1/3 oz Cu |
| MG2DF1005RF | RA | 1/2 oz Cu | 1.0mil TPI | 1/2 oz Cu |
Product Performance
Thin and Lightweight: The 2-layer FCCL is compact and lightweight, making it ideal for electronic devices where space-saving and weight reduction are critical.
Flexibility: It has excellent flexibility, capable of withstanding multiple bends and folds without compromising performance, making it suitable for electronic products with complex shapes and movable parts.
Superior Electrical Performance: 2-layer FCCL features a low dielectric constant (DK), which facilitates high-speed signal transmission, reducing signal delay and loss, making it perfect for high-frequency applications.
Thermal Stability: The material has outstanding thermal conductivity, allowing effective heat dissipation and ensuring stable operation of components under high-temperature conditions.
Heat Resistance: With a high glass transition temperature (Tg), 2-layer FCCL maintains good mechanical and electrical properties even in high-temperature environments, making it suitable for electronic products used in such conditions.
Reliability and Durability: Due to its stable chemical and physical properties, 2-layer FCCL maintains its performance over long periods, providing reliable long-term usage.
Suitable for Automated Production: Since 2-layer FCCL is usually supplied in roll form, it facilitates automated and continuous production during manufacturing, enhancing production efficiency and reducing costs.
Product Application
Rigid-Flex PCBs: 2-layer FCCL is widely used in the manufacture of rigid-flex PCBs, which combine the flexibility of flexible circuits with the mechanical strength of rigid PCBs, making them suitable for compact designs in complex electronic devices.
Chip on Film (COF): 2-layer FCCL is used in chip packaging technology directly on the film, commonly applied in displays, camera modules, and other space-constrained applications.
Flexible Printed Circuit Boards (FPCs): 2-layer FCCL is often used in the production of flexible printed circuit boards, which are widely applied in mobile devices, wearable technology, and medical equipment where lightweight and flexibility are required.
High-Frequency Communication Devices: Due to its low dielectric constant and excellent electrical properties, 2-layer FCCL is used in the manufacture of antennas and other key components in high-frequency communication devices.
Automotive Electronics: In automotive electronic systems, 2-layer FCCL is used to connect complex electronic modules, especially in environments where flexible connections and high-temperature resistance are needed.
These application areas highlight the extensive use and importance of 2-layer FCCL in modern electronic products.
