2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN
2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN Detail:
Product Introduction
The electrolytic copper foil produced by CIVEN METAL has excellent resistance to high temperatures and high ductility. The copper foil does not oxidize or change color at high temperatures, and its good ductility makes it easy to laminate with other materials. The copper foil produced by the electrolysis process has a very clean surface and a flat sheet shape. The copper foil itself is roughened on one side, which makes it easier to adhere to other materials. The overall purity of the copper foil is very high, and it has excellent electrical and thermal conductivity. In order to meet the needs of our customers, we can provide not only rolls of copper foil, but also customized slicing services.
Specifications
Thickness: 1/4OZ～20OZ(9µm～70µm)
Width: 550mm ～1295mm
Performance
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
Applications
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board.
Advantages
The product adopts a special surface treatment process to improve the product’s ability to resist bottom corrosion and reduce the risk of copper residue.
Performance(GB/T5230-2000、IPC-4562-2000)
|
Classification |
Unit |
1/4OZ (9μm) |
1/3OZ (12μm) |
J OZ (15μm) |
1/2OZ (18μm) |
1OZ (35μm) |
2OZ (70μm) |
|
|
Cu Content |
% |
≥99.8 |
||||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
127±4 |
153±5 |
283±5 |
585±10 |
|
|
Tensile Strength |
R.T.(25℃) |
Kg/mm2 |
≥28 |
≥30 |
||||
|
H.T.(180℃) |
≥15 |
|||||||
|
Elongation |
R.T.(25℃) |
% |
≥4.0 |
≥5.0 |
≥6.0 |
≥10 |
||
|
H.T.(180℃) |
≥4.0 |
≥5.0 |
≥6.0 |
|||||
|
Roughness |
Shiny(Ra) |
μm |
≤0.4 |
|||||
|
Matte(Rz) |
≤5.0 |
≤6.0 |
≤7.0 |
≤7.0 |
≤9.0 |
≤14 |
||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥1.0 |
≥1.2 |
≥1.2 |
≥1.3 |
≥1.8 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤5.0 |
||||||
|
Change of color(E-1.0hr/190℃) |
% |
Good |
||||||
|
Solder Floating 290℃ |
Sec. |
≥20 |
||||||
|
Pinhole |
EA |
Zero |
||||||
|
Preperg |
—- |
FR-4 |
||||||
Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.
2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).
3. Quality assurance period is 90 days from the date of receipt.
Product detail pictures:
Related Product Guide:
With reliable quality process, good reputation and perfect customer service, the series of products produced by our company are exported to many countries and regions for 2021 China New Design Copper Insulation Tape - HTE Electrodeposited Copper Foils for PCB – CIVEN , The product will supply to all over the world, such as: Chile, America, French, we are fully determined to control the whole supply chain so as to provide quality products at competitive price in a timely manner. We are keeping up with the advanced techniques, growing through creating more values for our clients and society.
By Daniel Coppin from Mongolia - 2018.09.29 17:23
Sales manager is very enthusiastic and professional, gave us a great concessions and product quality is very good,thank you very much!
By Roberta from Mauritius - 2018.07.26 16:51
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