2021 China New Design Calendering Copper Foil - RTF ED Copper Foil – CIVEN

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2021 China New Design Calendering Copper Foil - RTF ED Copper Foil – CIVEN Detail:

Product Introduction

Reverse treated electrolytic copper foil (RTF) is a copper foil that has been roughened to varying degrees on both sides. This strengthens the peel strength of both sides of the copper foil, making it easier to use as an intermediate layer for bonding to other materials. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.

Specifications

CIVEN can supply RTF electrolytic copper foil with nominal thickness of 12 to 35µm up to 1295mm width.

Performance

The high temperature elongation reversed treated electrolytic copper foil is subjected to a precise plating process to control the size of the copper tumors and distribute them evenly. The reversed treated bright surface of the copper foil can significantly reduce the roughness of the copper foil pressed together and provide sufficient peel strength of the copper foil. (See Table 1)

Applications

Can be used for high-frequency products and inner laminates, such as 5G base stations and automotive radar and other equipment.

Advantages

Good bonding strength, direct multi-layer lamination, and good etching performance. It also reduces the potential for short circuit and shortens the process cycle time.

Table 1. Performance

Classification		Unit	1/3OZ (12μm)	1/2OZ (18μm)	1OZ (35μm)
Cu Content		%	min. 99.8
Area Weigth		g/m²	107±3	153±5	283±5
Tensile Strength	R.T.(25℃)	Kg/mm²	min. 28.0
	H.T.(180℃)		min. 15.0	min. 15.0	min. 18.0
Elongation	R.T.(25℃)	%	min. 5.0	min. 6.0	min. 8.0
	H.T.(180℃)		min. 6.0
Roughness	Shiny(Ra)	μm	max. 0.6/4.0	max. 0.7/5.0	max. 0.8/6.0
	Matte(Rz)		max. 0.6/4.0	max. 0.7/5.0	max. 0.8/6.0
Peel Strength	R.T.(23℃)	Kg/cm	min. 1.1	min. 1.2	min. 1.5
Degraded rate of HCΦ(18%-1hr/25℃)		%	max. 5.0
Change of color(E-1.0hr/190℃)		%	None
Solder Floating 290℃		Sec.	max. 20
Pinhole		EA	Zero
Preperg		—-	FR-4

Note: 1. The Rz value of copper foil gross surface is the test stable value, not a guaranteed value.

2. Peel strength is the standard FR-4 board test value (5 sheets of 7628PP).

3. Quality assurance period is 90 days from the date of receipt.

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So as to provide you with ease and enlarge our business, we even have inspectors in QC Crew and guarantee you our best company and solution for 2021 China New Design Calendering Copper Foil - RTF ED Copper Foil – CIVEN , The product will supply to all over the world, such as: Seattle, Karachi, Karachi, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

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